Electrovert Cleaners Technical Papers

Electronic Assembly Misprint Cleaning Advancements

Electronic Assembly Misprint Cleaning Advancements

Assemblers surveyed report that cleaning misprinted circuit assemblies is a production gap that has not been adequately addressed. Traditionally, the industry has used stencil cleaning agents and equipment to address this rework need. One of the benefits of cleaning misprinted assemblies with the stencil cleaning process is the ability to collect and filter wet solder paste. The major short coming of cleaning misprints within stencil cleaning processes is the inability to remove B-side reflow flux residues from both the surface and under bottom termination components.

Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux Residue

Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux Residue

As the electronics industry moves toward the implementation of Pb-free soldering, the impact on the assembly process must be considered. One process that is often over looked is the cleaning of assembled printed circuit boards. How will the introduction of lead free material impact the cleaning process? A number of studies have proven the poorer wetting of SAC 305 alloys and many of the other Pb-free alloys as contrasted to Sn/Pb during the soldering process.