Camalot Dispensers Technical Papers

Dispensing: A Robust Process Solution for Shield Edge Interconnect

Dispensing: A Robust Process Solution for Shield Edge Interconnect

A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets.