Semiconductor Packaging

Semiconductor packaging is most simply the process of installing an integrated circuit, or chip, into a package, or active device (component) which then becomes part of a printed circuit board (PCB) assembly. ITW EAE’s production solutions not only assemble and solder PBC assemblies, but they also play a major role in semiconductor packaging, including dispensing underfills and encapsulant liquids, Thermal interface materials, Die attach adhesives, cleaning before and after wire bonding, and more. ITW EAE solutions also play a role in advanced packaging development, flip chip, Package on Package (PoP), die stacking/chip stacking, which is known as ‘vertical integration’.