Convection Reflow

Forced convection reflow is the preferred method of SMT reflow soldering of surface mounted components to a printed circuit board (PCB) today. The oven is typically separated into zones in which each zone is independently controlled to optimize the thermal profile of the oven’s process zone. Forced convection is controllable and highly efficient in terms of transferring heat to a SMT PCB assembly.

The Centurion solution:

  • Maximum heat transfer efficiency allows for reflow soldering at the lowest set-points reducing Delta T and minimizing power consumption
  • Patented Cathox flux management system greatly reduces flux residues and increases uptime at the same time as reducing N2 consumption
  • Enhanced zone definition options up to 140C allows fine tuning of all profiling challenges in last soak to peak zone
  • Fast Cool Down and Quick Recipe Change options reduces the time needed to run diverse products maximizing production throughput
  • AUTOset recipe generation minimizes new product introduction time to production
  • Dual Lane Dual Speed options to allow for two different products running at same with different profile requirements

The OmniMax/ES series ovens are used in multiple applications:

  • Lead and Lead-free SMT reflow;
  • High temperature ceramic/alumina hybrid reflow;
  • Pin-in-paste reflow;
  • Semiconductor;
  • LED attach;
  • Curing, including Solar (PV) applications;
  • Pre-bake for underfill;
  •  Other special applications.