MPM printers are high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils. Available in a wide range of capabilities.
Best-in-class printing performance has always been a hallmark of MPM printing technology, the recognized world standard for reliability, throughput, and high yields.
Dual Lane printing, with mesh screens or with metal foil stencils, can nearly double the throughput of a single printing machine, meeting growing demands for throughput volume without adding another printer; thus, a Dual Lane line instead of a traditional double-sided reflow line can greatly reduce capital requirements.
Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements.
MPM printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste.
Solder Paste, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount (SMT) PCB.
Stainless steel foil stencils are used to print solder paste and adhesives on bare PCBs. Stencils of varying thickness, and also ‘step’ stencils with varying thicknesses in specific areas for different deposition requirements are used.