Underfill

Underfill is used in a wide variety of packages and board-level assemblies, and Camalot® dispense systems, particularly the SmartStream® pump technology, perform fast, efficient, complete underfill for all types of packages reliably and repeatably. Underfill is dispensed and flowed under flip chips, direct chip attach on boards, stacked die packages, and various ball grid array (BGA) components where, once cured, stabilizes the component. With SmartStream, a controlled stream of material is dispensed using positive displacement with a piston, which does not contact seat or nozzle. SmartStream dispenses a column of material with each cycle instead of a single sphere, perfect for handling ever-shrinking clearances beneath the components, ever-smaller clearances between adjacent components, and increasing demands for positional accuracy and throughput.