Edge/Corner Bonding

Camalot® precision dispense technology ensures successful application of adhesives for both corner and edge bonding processes. Edge and corner bonding are used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs) and to increase reliability for drop testing. Edge bonding is dispensed prior to component placement and cured as part of the reflow process, whereas corner bonding is dispensed post-reflow and cured with an additional process (oven). The adhesive material must be precisely dispensed to wet the edge of the component while minimizing flow underneath, a level of dispense control that defines Camalot systems.