electrovert wave soldering Features

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Electra Wave

DwellMax Plus Solder Nozzle with Nitrogen Tunnel

 

DwellMax Plus is a patented process solution that meets the challenges of lead-free wave soldering.  The extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards, increasing throughput capability.  With conventional wave soldering technology, thick multi-layer and/or high thermal mass circuit boards are often accompanied by high cost from low yields, slow production speeds, rework costs, and the collateral damage associated with a rework loop.  The innovative design of DwellMax Plus alleviates these problems and provides better PTH fill at significantly faster conveyor speeds.  The benefits of the nitrogen tunnel include improved solder wetting and reduction in dross by up to 83%.

DwellMax Plus benefits include:

  • Compatible with Full or Short Nitrogen Tunnel
  • Increased topside hole fill;
  • Reduced defect rates;
  • Highest wave-height capability in industry;
  • Higher production rates;
  • Significantly less dross;
  • Reduced solder usage;
  • Reduced flux usage.

Electrovert’s DwellMax Plus is the key to a better bottom line through fewer defects and maximized productivity.

ExactaWave Automatic Wave Height

 

ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board.  Its ability withstand temperatures up to 300° (573°F) makes it perfectly suited for precision soldering applications.

The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance.  Thus, a set-point entered in a recipe always produces the same result.  The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.

Features for Value in Wave Soldering

 

Electrovert’s Electra, VectraElite, and VectraES2 offer a wide range of features and capabilities that increase the value of the wave solder process.  The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.

Value-based features include:

  • Lifetime warranty on solder pot casting (applies to original owner);
  • Recipe-driven automatic lead clearance;
  • FloLift™ technology increases the upward force of the waves just as the PCB passes over the wave.  This feature promotes maximum topside hole fill;
  • Stand-by-mode of solder waves that reduces the rpm of the solder wave just until the PCB is near the solder pot.  This feature reduces dross generation when no PCBs are being soldered;
  • Combination 2d/1d bar code reader can be combined with data logging for complete process control and automation;
  • Data-logging and trending of critical machine parameters;
  • Common Windows® based operating system and common GUI software across all Electrovert products (Wave, Reflow, and Cleaning).  This is a significant time saver to operators and engineers.  Minimal training is required when shifting from one product to another.
  • Common I/O interface across all Electrovert products (Wave, Reflow, and Cleaning).  This is significant to maintenance personnel and significant in that common spare parts can be used from one product to another.

Full Nitrogen Tunnel Feature

 

Electrovert’s full nitrogen tunnel feature includes all the same features and benefits of the short tunnel plus a fully inerted preheat section.  The innovative approach to inerting the preheat section allows for forced convection preheat in preheat location #1 (closest to solder) and in both upper/lower positions.

Benefits of the nitrogen tunnel include:

  • Available for use with UltraFill and DwellMax Plus nozzles
  • Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy);
  • Complete and easy access to all preheat, fluxer, and solder pot area from rear of machine
  • Fully inerted tunnel Inerted environment allows the use of milder fluxes and/or a reduced amount of flux applied;
  • Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area;
  • Full Tunnel is field upgradable ( check with factory).

Preheat Features

 

The Electra is capable of up to 2.4 meters (8 feet) of bottom side preheat and up to 1.8 meters (6 feet) of topside preheat.  Multiple forms of preheat are offered for complete process flexibility; these include IsoThermal™ forced convection, fast response IR, and Infrared radiant.  All preheat modules are ‘plug and play’, allowing preheat configurations to be located in any position, location, and 100% interchangeable.

Quick Change Solder Pot

 

Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots.  This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot.  The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.

Quick-change pot benefits include:

  • Use of multiple alloys;
  • Easy changeover;
  • Built-in safety features;
  • All critical process features of the wave solder machine remain integrated between the multiple solder pots:
    • Standard wave features such as FloLift, stand-by-mode, RPM control, alarms, and data logging;
    • Auto-lead clearance;
    • Optional ExactaWave (auto wave-height control);
  • One pot/cart can be used on multiple machines of the same model and vintage (check with factory);
  • Field upgradable

ServoJet Fluxing Application System

 

The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization.  It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage.  The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software. 

High end fluxer capabilities include:

  • Precision selective fluxing capability that applies different flux volumes to individual sections of the board;
  • OA version available for aggressive water soluble type fluxes;
  • Optional Dual Flux capability;
  • User-defined automatic self-clean;
  • Field upgradable.

ServoJet benefits include:

  • Accurate flux control that reduces bridging;
  • Improved hole penetration;
  • Reduced flux consumption;
  • Precision selective fluxing (standard ServoJet version);
  • Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
  • 100% integrated into machine software providing data logging and trending capability;
  • Applies to a wide range of fluxes.

ServoSonic Flux Application System

 

The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system.  It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function.  The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.

The ServoSonic benefits include:

  • Ultrasonic atomized air delivery system;
  • Ability to spray in one or both directions;
  • Reduced flux consumption;
  • Reduced maintenance costs;
  • Selective flux capability;
  • 100% integrated into wave solder machine software providing data logging and trending capability;

Applies to a wide range of fluxes

ServoSpray Flux Application System

 

ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership.  ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system.  ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.

ServoSpray benefits include:

  • Ability to spray in one or both directions;
  • Improved top side hole penetration;
  • Reduced flux consumption;
  • Reduced maintenance costs;
  • Selective flux capability;
  • Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
  • 100% integrated into machine software providing data logging and trending capability;
  • Applies to a wide range of fluxes.

Short Nitrogen Tunnel Feature

 

Electrovert’s nitrogen tunnel utilizes patented technology that inerts at the solder wave area only.  This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.

Benefits of the nitrogen tunnel include:
  • Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy)
  • Minimal distance between preheat and solder contact area
  • Inerted environment allows the use of milder fluxes and/or a reduced amount of flux applied
  • Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area
  • Simple, efficient design provides easy access to solder module
  • Short Tunnel is field upgradable (check with factory).

UltraFill Solder Nozzle

 

The patented UltraFill solder nozzle is an ideal solution for lead-free soldering.  The UltraFill nozzle is 40% wider than traditional tin-lead nozzle to increase contact time.  The nozzle placement reduces the temperature drop between nozzles and improves hole fill.  UltraFill allows either air or nitrogen operation through the same design without switching nozzles.  Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).

VectraElite Wave

DwellMax Plus Solder Nozzle with Nitrogen Tunnel

 

DwellMax Plus is a patented process solution that meets the challenges of lead-free wave soldering.  The extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards, increasing throughput capability.  With conventional wave soldering technology, thick multi-layer and/or high thermal mass circuit boards are often accompanied by high cost from low yields, slow production speeds, rework costs, and the collateral damage associated with a rework loop.  The innovative design of DwellMax Plus alleviates these problems and provides better PTH fill at significantly faster conveyor speeds.  The benefits of the nitrogen tunnel include improved solder wetting and reduction in dross by up to 83%.

DwellMax Plus benefits include:

  • Compatible with Full or Short Nitrogen Tunnel
  • Increased topside hole fill;
  • Reduced defect rates;
  • Highest wave-height capability in industry;
  • Higher production rates;
  • Significantly less dross;
  • Reduced solder usage;
  • Reduced flux usage.

Electrovert’s DwellMax Plus is the key to a better bottom line through fewer defects and maximized productivity.

ExactaWave Automatic Wave Height

 

ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board.  Its ability withstand temperatures up to 300° (573°F) makes it perfectly suited for precision soldering applications.

The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance.  Thus, a set-point entered in a recipe always produces the same result.  The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.

Features for Value in Wave Soldering

 

Electrovert’s Electra, VectraElite, and VectraES2 offer a wide range of features and capabilities that increase the value of the wave solder process.  The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.

Value-based features include:

  • Lifetime warranty on solder pot casting (applies to original owner);
  • Recipe-driven automatic lead clearance;
  • FloLift™ technology increases the upward force of the waves just as the PCB passes over the wave.  This feature promotes maximum topside hole fill;
  • Stand-by-mode of solder waves that reduces the rpm of the solder wave just until the PCB is near the solder pot.  This feature reduces dross generation when no PCBs are being soldered;
  • Combination 2d/1d bar code reader can be combined with data logging for complete process control and automation;
  • Data-logging and trending of critical machine parameters;
  • Common Windows® based operating system and common GUI software across all Electrovert products (Wave, Reflow, and Cleaning).  This is a significant time saver to operators and engineers.  Minimal training is required when shifting from one product to another.
  • Common I/O interface across all Electrovert products (Wave, Reflow, and Cleaning).  This is significant to maintenance personnel and significant in that common spare parts can be used from one product to another.

Preheat Features

 

The Electra is capable of up to 2.4 meters (8 feet) of bottom side preheat and up to 1.8 meters (6 feet) of topside preheat.  Multiple forms of preheat are offered for complete process flexibility; these include IsoThermal™ forced convection, fast response IR, and Infrared radiant.  All preheat modules are ‘plug and play’, allowing preheat configurations to be located in any position, location, and 100% interchangeable.

Quick Change Solder Pot

 

Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots.  This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot.  The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.

Quick-change pot benefits include:

  • Use of multiple alloys;
  • Easy changeover;
  • Built-in safety features;
  • All critical process features of the wave solder machine remain integrated between the multiple solder pots:
    • Standard wave features such as FloLift, stand-by-mode, RPM control, alarms, and data logging;
    • Auto-lead clearance;
    • Optional ExactaWave (auto wave-height control);
  • One pot/cart can be used on multiple machines of the same model and vintage (check with factory);
  • Field upgradable

ServoJet Fluxing Application System

 

The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization.  It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage.  The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software. 

High end fluxer capabilities include:

  • Precision selective fluxing capability that applies different flux volumes to individual sections of the board;
  • OA version available for aggressive water soluble type fluxes;
  • Optional Dual Flux capability;
  • User-defined automatic self-clean;
  • Field upgradable.

ServoJet benefits include:

  • Accurate flux control that reduces bridging;
  • Improved hole penetration;
  • Reduced flux consumption;
  • Precision selective fluxing (standard ServoJet version);
  • Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
  • 100% integrated into machine software providing data logging and trending capability;
  • Applies to a wide range of fluxes.

ServoSonic Flux Application System

 

The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system.  It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function.  The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.

The ServoSonic benefits include:

  • Ultrasonic atomized air delivery system;
  • Ability to spray in one or both directions;
  • Reduced flux consumption;
  • Reduced maintenance costs;
  • Selective flux capability;
  • 100% integrated into wave solder machine software providing data logging and trending capability;

Applies to a wide range of fluxes

ServoSpray Flux Application System

 

ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership.  ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system.  ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.

ServoSpray benefits include:

  • Ability to spray in one or both directions;
  • Improved top side hole penetration;
  • Reduced flux consumption;
  • Reduced maintenance costs;
  • Selective flux capability;
  • Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
  • 100% integrated into machine software providing data logging and trending capability;
  • Applies to a wide range of fluxes.

Short Nitrogen Tunnel Feature

 

Electrovert’s nitrogen tunnel utilizes patented technology that inerts at the solder wave area only.  This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.

Benefits of the nitrogen tunnel include:
  • Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy)
  • Minimal distance between preheat and solder contact area
  • Inerted environment allows the use of milder fluxes and/or a reduced amount of flux applied
  • Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area
  • Simple, efficient design provides easy access to solder module
  • Short Tunnel is field upgradable (check with factory).

UltraFill Solder Nozzle

 

The patented UltraFill solder nozzle is an ideal solution for lead-free soldering.  The UltraFill nozzle is 40% wider than traditional tin-lead nozzle to increase contact time.  The nozzle placement reduces the temperature drop between nozzles and improves hole fill.  UltraFill allows either air or nitrogen operation through the same design without switching nozzles.  Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).

VectraES Wave

ExactaWave Automatic Wave Height

 

ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board.  Its ability withstand temperatures up to 300° (573°F) makes it perfectly suited for precision soldering applications.

The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance.  Thus, a set-point entered in a recipe always produces the same result.  The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.

Features for Value in Wave Soldering

 

Electrovert’s Electra, VectraElite, and VectraES2 offer a wide range of features and capabilities that increase the value of the wave solder process.  The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.

Value-based features include:

  • Lifetime warranty on solder pot casting (applies to original owner);
  • Recipe-driven automatic lead clearance;
  • FloLift™ technology increases the upward force of the waves just as the PCB passes over the wave.  This feature promotes maximum topside hole fill;
  • Stand-by-mode of solder waves that reduces the rpm of the solder wave just until the PCB is near the solder pot.  This feature reduces dross generation when no PCBs are being soldered;
  • Combination 2d/1d bar code reader can be combined with data logging for complete process control and automation;
  • Data-logging and trending of critical machine parameters;
  • Common Windows® based operating system and common GUI software across all Electrovert products (Wave, Reflow, and Cleaning).  This is a significant time saver to operators and engineers.  Minimal training is required when shifting from one product to another.
  • Common I/O interface across all Electrovert products (Wave, Reflow, and Cleaning).  This is significant to maintenance personnel and significant in that common spare parts can be used from one product to another.

Full Nitrogen Tunnel Feature

 

Electrovert’s full nitrogen tunnel feature includes all the same features and benefits of the short tunnel plus a fully inerted preheat section.  The innovative approach to inerting the preheat section allows for forced convection preheat in preheat location #1 (closest to solder) and in both upper/lower positions.

Benefits of the nitrogen tunnel include:

  • Available for use with UltraFill and DwellMax Plus nozzles
  • Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy);
  • Complete and easy access to all preheat, fluxer, and solder pot area from rear of machine
  • Fully inerted tunnel Inerted environment allows the use of milder fluxes and/or a reduced amount of flux applied;
  • Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area;
  • Full Tunnel is field upgradable ( check with factory).

Preheat Features

 

The Electra is capable of up to 2.4 meters (8 feet) of bottom side preheat and up to 1.8 meters (6 feet) of topside preheat.  Multiple forms of preheat are offered for complete process flexibility; these include IsoThermal™ forced convection, fast response IR, and Infrared radiant.  All preheat modules are ‘plug and play’, allowing preheat configurations to be located in any position, location, and 100% interchangeable.

Quick Change Solder Pot

 

Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots.  This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot.  The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.

Quick-change pot benefits include:

  • Use of multiple alloys;
  • Easy changeover;
  • Built-in safety features;
  • All critical process features of the wave solder machine remain integrated between the multiple solder pots:
    • Standard wave features such as FloLift, stand-by-mode, RPM control, alarms, and data logging;
    • Auto-lead clearance;
    • Optional ExactaWave (auto wave-height control);
  • One pot/cart can be used on multiple machines of the same model and vintage (check with factory);
  • Field upgradable

ServoJet Fluxing Application System

 

The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization.  It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage.  The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software. 

High end fluxer capabilities include:

  • Precision selective fluxing capability that applies different flux volumes to individual sections of the board;
  • OA version available for aggressive water soluble type fluxes;
  • Optional Dual Flux capability;
  • User-defined automatic self-clean;
  • Field upgradable.

ServoJet benefits include:

  • Accurate flux control that reduces bridging;
  • Improved hole penetration;
  • Reduced flux consumption;
  • Precision selective fluxing (standard ServoJet version);
  • Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
  • 100% integrated into machine software providing data logging and trending capability;
  • Applies to a wide range of fluxes.

ServoSonic Flux Application System

 

The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system.  It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function.  The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.

The ServoSonic benefits include:

  • Ultrasonic atomized air delivery system;
  • Ability to spray in one or both directions;
  • Reduced flux consumption;
  • Reduced maintenance costs;
  • Selective flux capability;
  • 100% integrated into wave solder machine software providing data logging and trending capability;

Applies to a wide range of fluxes

ServoSpray Flux Application System

 

ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership.  ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system.  ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.

ServoSpray benefits include:

  • Ability to spray in one or both directions;
  • Improved top side hole penetration;
  • Reduced flux consumption;
  • Reduced maintenance costs;
  • Selective flux capability;
  • Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
  • 100% integrated into machine software providing data logging and trending capability;
  • Applies to a wide range of fluxes.

Short Nitrogen Tunnel Feature

 

Electrovert’s nitrogen tunnel utilizes patented technology that inerts at the solder wave area only.  This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.

Benefits of the nitrogen tunnel include:
  • Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy)
  • Minimal distance between preheat and solder contact area
  • Inerted environment allows the use of milder fluxes and/or a reduced amount of flux applied
  • Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area
  • Simple, efficient design provides easy access to solder module
  • Short Tunnel is field upgradable (check with factory).

UltraFill Solder Nozzle

 

The patented UltraFill solder nozzle is an ideal solution for lead-free soldering.  The UltraFill nozzle is 40% wider than traditional tin-lead nozzle to increase contact time.  The nozzle placement reduces the temperature drop between nozzles and improves hole fill.  UltraFill allows either air or nitrogen operation through the same design without switching nozzles.  Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).