Texture Based Inspection^®

Texture Based Inspection

Features

Patented MPM Technology
Most accurate analysis taught from stencil apertures
Identifies paste transfer and bridging defects early in the process line using Texture structure of the solder paste.
Eliminates shadowing effect
Pixel level data acquisition enables most accurate analysis for highest confidence results
Programmable limits enable threshold values for application matching
Minimal impact to cycle time as preferred during the same time as standard contrast based 2D.
The most effective type of 2D Inspection incorporates both texture based and gray scale methods to determine the percentage of paste that is covering the target aperture both on and off the pad.
Users can add to their bottom-line profit by using inspection and data processing tools. If implemented to their full advantage, 2D Inspection coupled with SPC data collection increases board quality and yield to provide a quick return on investment. They create a “smart” printing system that allows engineers to have complete control over process variables when they need it most – before defective products are built.
Technology used for bridge detection (PCB) and stencil inspection (presence of solder paste on stencil surface)
Available for Accela, Momentum Series, Momentum Dual Lane and MPM 125 platforms