A quantum leap in the stencil printing process, the Rheometric Pump provides precise control of material deposition while reducing paste waste, increasing yields and reducing material costs. With the Rheometric Pump, print media such as solder paste, adhesives and flux, maintain their ideal printability characteristics because they are not exposed to air. In addition, since the material is contained within an enclosed head and not allowed to leak outside of the print area, very little material is wasted. Material savings of up to 50% are possible when using Rheometric pump technology compared to traditional squeegee blade printing.
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