2D Contrast Based Inspection^®

2D Contrast Based Inspection

Most cost effective system to verify print and paste deposit results.
Flexible for today’s most challenging components
MPM’s patented vision system measures the amount of paste that is covering the target pad and compares it against the required coverage.
2D Inspection that is integrated directly into the stencil printer provides an immediate source of data
Effective way to eliminate print defects and increase overall yield faster using in-line 2D inspection; with accuracy as reliable as end-of-process inspection systems (SPI)— but at a fraction of the cost. Approximately up to 90% or more of all print defects and trends can be identified by verifying the amount of paste covering the target pad. This method identifies the lack of paste being deposited on the pad resulting in unacceptable solder joints.
Available for Accela, Momentum Series, Momentum Dual Lane and MPM 125 platforms