The ACCEL MicroLine Precision Cleaning System is ideally suited for semiconductor assembly packaging suppliers processing delicate components/wafers. The system brings a level of engineering, quality, and performance not found in large, in-line machines. With innovations like the patented Integrated Flow Module, the platform delivers non-contact, in-line cleaning for critical applications, such as CSPs/BGAs, Hybrids/MCMs, and complex mixed technology modules. The unit incorporates automated, in-line spray cleaning technology in a small footprint offering solvent versatility and on-board water recycling.
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