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MicroLine In-Line Cleaning System

The ACCEL MicroLine in-line precision cleaning system is ideally suited for semiconductor assembly packaging suppliers processing delicate components/wafers. With innovations like the patented Integrated Flow Module, the platform delivers non-contact, in-line cleaning for critical applications, such as CSPs/BGAs, Hybrids/MCMs, and complex mixed technology modules.

• Integrated flow module provides high performance flooding and cleaning action
• Touch-free cleaning capability to clean parts in carriers in-line
• Small footprint in-line cleaning
• Zero-discharge, closed-loop system