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MicroLine™

The ACCEL MicroLine™ Precision Cleaning System is ideally suited for semiconductor assembly packaging suppliers processing delicate components/wafers. The system brings a level of engineering, quality, and performance not found in large, in-line machines. With innovations like the patented Integrated Flow Module, the platform delivers non-contact, in-line cleaning for critical applications, such as CSPs/BGAs, Hybrids/MCMs, and complex mixed technology modules. The unit incorporates automated, in-line spray cleaning technology in a small footprint offering solvent versatility and on-board water recycling.

Features

  • Integrated Flow Module provides 100% contaminant removal and complete rinsing and drying of the part and the carrier
  • Zero Discharge System automatically removes solvents from used rinse water and returns to wash reservoir for reuse - no drain is required
  • Carbon and DI resin filter cartridges slide out for easy draining and replacement
  • Touch-Free Cleaning - parts cleaned in trays or boats are retained in their carriers by a smooth, continuous "ceiling" positioned a few thousandths of an inch above them


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