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MicroCel™

The ACCEL MicroCel™ system provides incomparable cleaning of electronic circuit assemblies, precision parts, medical devices, bumped wafers and advanced packages, such as flip chips, MCMs, SIPs, BGAs, CSPs, and hybrid circuits. It's the first technology to use centrifugal energy for unparalleled penetration, solubilization, and contaminant removal. This system features a sealed cleaning chamber, a robot head to retain parts or wafers, a solvent-compatible wash reservoir, zero-discharge rinse system and a microprocessor control system. Components or assemblies to be cleaned are placed into a fixture that is mounted to the robot head. The head lowers components into the process chamber, which is sealed from the surrounding atmosphere. The fixture is immersed and then spins wafers in the process chamber, removing contaminants with wash chemistry solubilization and a combination of centrifugal and coriolis forces. After cleaning, the chamber is drained and a rinse agent is sprayed onto rotating parts. Components are not submerged during rinsing, eliminating the possibility that contaminants might be redeposited onto cleaned surfaces. The rinse agent is removed centrifugally from cleaned parts and heated air dries residual moisture before wafers are removed.

Features

• Handles most cleaning solvents
• Unparalleled cleaning -- Ionic contamination of 0.00 micrograms/ inch?, surface insulation resistance greater than 1014 ohms/square, and no visible residue
• Zero Discharge System automatically removes solvents from used rinse water and returns to wash reservoir for reuse - no drain is required
• Typical cycle times from wash to dry:
  • PCB, BGA apps - 3.5 to 7 minutes
  • Flip-chip, bumper wafer apps - 7 to 15 minutes
• Small footprint of only 18 square feet